ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,480,719, issued on Nov. 25, was assigned to Rondo Energy Inc. (Alameda, Calif.). "Thermal energy storage system for simple and combined cycle p... Read More
ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,479,888, issued on Nov. 25, was assigned to HDL SOLUTIONS OTTAWA (Ottawa). "Polypeptide and application thereof" was invented by Fumin Dong (Ot... Read More
ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,484,182, issued on Nov. 25, was assigned to Dell Products LP (Round Rock, Texas). "Rack front-to-rear cable routing system" was invented by Vic... Read More
ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,481,519, issued on Nov. 25, was assigned to Dell Products LP (Round Rock, Texas). "Self-adaptive event notification frequency for nodes in a hy... Read More
ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,483,643, issued on Nov. 25, was assigned to HONOR DEVICE Co. LTD. (Shenzhen, China). "Rotating mechanism and foldable electronic device" was in... Read More
ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,479,786, issued on Nov. 25, was assigned to Shin-Etsu Chemical Co. Ltd. (Tokyo). "11-halo-1,1-dialkoxy-7-undecene compound and processes for pr... Read More
ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,483,982, issued on Nov. 25, was assigned to Universal Electronics Inc. (Scottsdale, Ariz.). "Wireless sensor transmission method and apparatus"... Read More
ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,478,866, issued on Nov. 25, was assigned to Kabam Inc. (San Francisco). "Dynamic online game implementation on a client device" was invented by... Read More
ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,483,688, issued on Nov. 25, was assigned to The Nielsen Co. (US) LLC (New York). "Methods and apparatus for automatic tv on/off detection" was ... Read More
ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,786, issued on Nov. 25, was assigned to Yangtze Memory Technologies Co. Ltd. (Wuhan, China). "Hybrid wafer bonding method" was invented by ... Read More